Be/Cu/HR-1不锈钢扩散连接界面特性

以Cu为中间层材料,采用Greeble1500热模拟试验机对Be/HR-1不锈钢进行扩散连接试验,利用PME Olympus Tokyo光学显微镜、扫描电镜(SEM)、显微硬度计(HV-1000)、X射线衍射仪研究分析了其界面特性.研究表明,Cu层过渡材料能有效阻碍Be和Fe之间的互扩散以及阻挡不锈钢中合金元素Ni、Cr等向铍基体的扩散,从而阻碍了它们之间金属间化合物在扩散区内的形成,但它也带来了新的金属间化合物如Be2Cu;金属间化合物优先沿晶界生成,呈三维网状分布;元素的扩散主要沿晶界进行,且扩散不是各个部位均等的向前推进,也没有单一的金属间化合物薄层形成;试样的断裂位置在Be/Cu界面处.

Interface Characteristic of Diffusion Bonding on Be/Cu/HR-1 Stainless Steel

Cu is used as the mesosphere material in the experiment, and the diffusion-bonding experiment of Be/Cu/HR-1 stainless steel is made on the Greeble1500 hot stimulation test-machine. The interface characteristics of the diffusion bonding are studied by means of the Scanning Electron-Microscope, the X-ray Diffraction and the HV-1000 Micro-hardness Tester. The results show that Cu can countercheck the mutual diffusion between Be and Fe, as well as the diffusion of Ni and Cr from the stainless steel to Be, resultingly, restrain the formation of the intermetallic compounds among them, but the Be_(2)Cu is formed because of diffusion of Cu, and the intermetallic compounds is firstly formed along grain boundry and distributed as net-like, and the diffusion of elements is made along the grain boundry and their diffusion is non-uniform, and also does not form the layer of the single intermetallic compound. The fracture of the sample lies at the Be/Cu interface area.