| SiC材料导热系数和热膨胀系数与温度关系 |
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| 引用本文： | 吴清仁,文璧璇.SiC材料导热系数和热膨胀系数与温度关系[J].华南理工大学学报(自然科学版),1996(3). |
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| 作者姓名： | 吴清仁 文璧璇 |
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| 作者单位： | 华南理工大学无机材料科学与工程系 |
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| 摘 要： | 研究冷等静压ＳｉＣ材料导热系数和热膨胀系数与温度的关系。结果表明，ＳｉＣ材料导热系数（λ）与温度（Ｔ）成反比，其线膨胀系数（ａ）与温度成正比。从理论上探讨了提高其热稳定性的途径；给出了ＳｉＣ材料导热系数和线膨胀系数与温度之间的关联式，为高温陶瓷换热器的设计及应用提供科学依据。
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| 关 键 词： | 碳化硅 等静压 导热系数 线膨胀系数 材料热物理 |
STUDIES ON TEMPERATURE DEPENDENCE OF THERMAL CONDUCTIVITY AND LINEAR EXPANSION FOR SiC MATERIAL |
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| Wu Qingren, Wen Bixuan.STUDIES ON TEMPERATURE DEPENDENCE OF THERMAL CONDUCTIVITY AND LINEAR EXPANSION FOR SiC MATERIAL[J].Journal of South China University of Technology(Natural Science Edition),1996(3). |
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| Authors: | Wu Qingren Wen Bixuan |
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| Abstract: | In this paper, temperature dependence of thermal conducticity and linear expansion for SiC made with iso-static pressing process are studied. The results show that thermal conductivity of SiC is inversely proportional to temperature, and the coefficient of linear expansion is directly proportional to temperature. Some ways to improve the thermal steadiness of SiC materials are explored theoretically. The emperical correlations between thermal conductivity and temperature, and coefficient of linear expansion and temperature are given in this paper.These provide the scientific foundation for the design and application of ceramic heat exchangers under high temperature condition. |
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| Keywords: | s: SiC iso-static pressing process thermal conductivity coefficient of linear expansion materials thermophysics |
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