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脉冲化学镀与化学镀非晶态Ni—P合金镀层的微观结构
引用本文:刘珍,陈文彦.脉冲化学镀与化学镀非晶态Ni—P合金镀层的微观结构[J].太原理工大学学报,1998,29(5):511-513.
作者姓名:刘珍  陈文彦
作者单位:[1]太原理工大学材料工程系 [2]山西科兴公司
摘    要:利用X射线衍射(XRD)及热分析(DTA)技术,研究了脉冲化学镀与化学镀非晶态Ni-P合金的原子分布函数及晶化过程,得出了两种非晶态合金铁微观结构信息(平均原子间距,相应配位原子数和短程有序畸)及各特征温度的晶化激活能。

关 键 词:脉冲化学镀  化学镀  非晶态合金  镀层  微观结构

Microstructures of Amorphous Ni-P Alloys Prepared by Impulse Electroless and Electroless Plating
Liu,Zhen.Microstructures of Amorphous Ni-P Alloys Prepared by Impulse Electroless and Electroless Plating[J].Journal of Taiyuan University of Technology,1998,29(5):511-513.
Authors:Liu  Zhen
Institution:Liu Zhen (Dept. of Mat.Sci.Engg.) Chen Wenyan (Kexin Group Ltd.)
Abstract:By means of XRD and DTA, were studied the atomic distribution functions and crystallization process of amorphous Ni-P alloys prepared by impulse electroless and electroless plating.Knowledge of the microstructure,such as average atom distance and the scale of short range order,and the values of activation energy for crystallization at each characteristic temperature were obtained.The results show that the scale of short range order of impulse electroless is less and the starting activation is higher than that of electroless for about 0.1 nm and 26 kJ/mol.Compared with amorphous Ni P alloys prepared by rapid quenching ,The scales of short range order of impulse electroless and electroless of amorphous alloys prepared by impulse electroless and electroless plating is put forward.
Keywords:impulse  electroless  plating  electroless  plating  amorphous  alloy  atomic  distribution  function  activation  energy  for  crystallization  depositing  mechanism
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