模拟及混合信号芯片的可测性设计

对现有模拟及混合信号芯片可测性设计方法从测试内容、测试信号传输路径、测试信号产生及检测方式等不同角度进行了分类和分析比较。研究指出，在测试内容方面，基于结构的方法由于可得到较高的故障覆盖率并容易对其进行量化计算，因此被认为是今后发展的主要方向；在测试信号传输路径方面，基于总线的方法具有较易实现标准化的优点；而在测试信号产生及检测方面，内建自测试可大大降低测试所需代价，因此有较大的研究应用前景．统一的低测试代价和高故障覆盖率的模拟及混合信号芯片可测性设计方法的产生对于芯片设计来说将是进一步发展的要求和保障．

Design-for-testability of analog and mixed-signal IC

AMS (analog and mixed signal) IC (integrated circuit) DFT (design for testability) methods are classified by test content, test pattern transporting path, test pattern generation and check up manner. These classifications are analyzed and compared based on existing AMS DFT schemes. Structure based DFT method will get primary development since relatively high fault coverage could easily be obtained and calculated quantitatively. On test pattern transporting path, test bus based method will lead to standardization more easily. On test pattern generation and check up, built in self test will get extensive application because of the significant reduce of test cost. The generation of a sort of uniform AMS IC DFT technique with low test cost and high fault coverage will meet the need of further development on IC design.