| 镀银铜粉导电电子浆料的研究 |
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| 引用本文： | 彭舒,唐振方,周序乐.镀银铜粉导电电子浆料的研究[J].科学技术与工程,2007,7(9):1868-1871. |
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| 作者姓名： | 彭舒 唐振方 周序乐 |
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| 作者单位： | 暨南大学物理系,广州,510632 |
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| 摘 要： | 研究了以镀银铜粉为导电填料的电子浆料，讨论了镀银铜粉含量、硅烷偶联剂的用量以及处理方法对导电浆料导电性能的影响。结果表明，当镀银铜粉填充含量达75％，偶联剂含量3％时，导电浆料的导电性、分散性、稳定性等性能较好。
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| 关 键 词： | 导电浆料 镀银铜粉 偶联剂 环氧树脂 |
| 文章编号： | 1671-1819(2007)09-1868-04 |
| 收稿时间： | 2006-12-07 |
| 修稿时间： | 2006年12月7日 |
Study on Silver Plating Copper Powder Electro-conductive Paint |
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| PENG Shu,TANG Zhen-fang,ZHOU Xu-le.Study on Silver Plating Copper Powder Electro-conductive Paint[J].Science Technology and Engineering,2007,7(9):1868-1871. |
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| Authors: | PENG Shu TANG Zhen-fang ZHOU Xu-le |
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| Abstract: | A composite conductive paint based on silver plating copper powder and epoxy resin was developed, and the effects of silver plating copper powder and coupling agent on the conductivity of paint were discussed. The results showed that the conductive properties of paint was the best when the amount of silver plating copper powder and coupling agent, 75% and 3 %, respectively. Compared with copper conductive adhesive, it has better stability and depersion. |
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| Keywords: | isotropic conductive adhesive silver plating copper powder coupling agent epoxy resin |
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