| 化学置换镀铜 |
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| 引用本文： | 丁素芳,牛家治.化学置换镀铜[J].淮北煤炭师范学院学报(自然科学版),1995(3). |
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| 作者姓名： | 丁素芳 牛家治 |
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| 作者单位： | 淮北煤师院化学系
(丁素芳)，淮北煤师院化学系(牛家治) |
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| 摘 要： | 本文介绍了置换镀铜的原理和方法,并探讨了除锈工艺、镀液浓度、温度、添加剂等诸多因素对镀层质量的影响。
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| 关 键 词： | 置换镀 硫酸铜 硫脲 |
Chemical Displacement Plating Copper |
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| DingSufang NiuJiazhi.Chemical Displacement Plating Copper[J].Journal of Huaibei Coal Industry Teachers College(Natural Science edition),1995(3). |
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| Authors: | DingSufang NiuJiazhi |
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| Institution: | Department of Chemistry |
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| Abstract: | This paper repitred a piece of principle and method on displacement plating copper .It studied the mtereference of plating quality (technoloyy on griding iron, concdrtion of plating soulution. temperature and additives ect) |
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| Keywords: | displacement olating cupric sulfate thiourea |
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