| 一种3D IC TSV互连的内建自测试和自修复方法 |
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| 引用本文： | 王秋实,谭晓慧,龚浩然,冯建华.一种3D IC TSV互连的内建自测试和自修复方法[J].北京大学学报(自然科学版),2014,50(4):690-696. |
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| 作者姓名： | 王秋实 谭晓慧 龚浩然 冯建华 |
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| 作者单位： | 1. 北京大学微纳电子学系, 北京 100871; 2. 北京大学深圳研究生院集成微系统重点实验室, 深圳 518055; |
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| 基金项目： | 国家自然科学基金(61176039)资助 |
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| 摘 要： | 提出一种检测和修复有缺陷TSV的内建自测试(BIST)和内建自修复(BISR)的方法。采用BIST电路测试TSV, 根据测试结构, 采用BISR电路配置TSV映射逻辑, 有故障的TSV可被BISR电路采用TSV冗余修复。所提出的设计可减小TSV测试价格, 并减少TSV缺陷引起的成品率损失。电路模拟表明, 面积代价和时间代价是可接受的。
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| 关 键 词： | 三维集成电路 硅通孔 内建自测试 内建自修复 冗余 |
| 收稿时间： | 2013-04-03 |
A Built-In Self-Test & Repair Scheme for TSV Interconnect in 3D ICs |
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| WANG Qiushi;TAN Xiaohui;GONG Haoran;FENG Jianhua.A Built-In Self-Test & Repair Scheme for TSV Interconnect in 3D ICs[J].Acta Scientiarum Naturalium Universitatis Pekinensis,2014,50(4):690-696. |
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| Authors: | WANG Qiushi;TAN Xiaohui;GONG Haoran;FENG Jianhua |
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| Institution: | 1. Department of Microelectronics, Peking University, Beijing 100871; 2. Key Lab of Integrated Microsystems Science Engineering and Application, Shenzhen Graduate School of Peking University, Shenzhen 518055; |
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| Abstract: | A built-in-self-test (BIST) & built-in-self-repair (BISR) scheme for detecting and repairing defective TSVs are proposed. The BIST circuit tests the TSVs, then the BISR circuit configures the TSV mapping logic according to the test result. The faulty TSV will be repaired by BISR circuit using TSV redundancy. The proposed design reduces the cost of TSV test, as well as mitigates the yield loss caused by TSV defects. Circuit simulations show that the area overhead and time overhead are acceptable. |
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| Keywords: | 3D IC TSV BIST BISR redundancy |
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