聚(间二乙炔基苯-甲基氢硅烷)/含乙炔基苯并噁嗪树脂共混体系固化行为及其耐热性能研究

聚（间二乙炔基苯-甲基氢硅烷）（PSA）和含乙炔基苯并噁嗪树脂（A-PBZ）在热作用下均能够聚合形成交联网状结构。研究了PSA/A-PBZ共混树脂（SB）的固化行为。通过红外光谱（FT-IR）、旋转流变仪和差示扫描量热仪（DSC）研究了PSA/A-PBZ质量比为5：2时共混树脂（SB-2）的固化特性，利用动态DSC分析，根据Kissinger方法和Ozawa方法计算得出SB-2共混树脂固化反应的表观活化能分别为108.4 kJ/mol、111.1 kJ/mol，反应级数分别为0.93和0.95，固化反应遵循一级反应机理。同时还对SB共混树脂体系的耐热性能进行了探究，热重分析（TGA）结果表明：在氮气和空气氛围下，SB共混树脂固化物失重5%的温度（T_d5）和1 000℃时的质量保留率均随着A-PBZ树脂加入量的增加而减小，但SB共混树脂仍然表现出优异的耐热性能。

Curing behavior and heat resistance of poly (m-diethynylbenzene-methylsilane)/acetylene-functional benzoxazine blended resins

Poly (m-diethynylbenzene-methylsilane) (PSA) and acetylene-functionalized benzoxazine resin (A-PBZ) have been thermally co-polymerized to form a cross-linked structure. The curing behavior of the PSA/A-PBZ blended resins (SB) was studied. The curing properties of the SB-2 blending resins were studied by FT-IR, rheological analysis and DSC. Dynamic DSC analysis gave a value of the apparent activation energy for the curing reaction of the SB-2 blending resin of about 108 kJ/mol (using the Kissinger method) and 111 kJ/mol (using the Ozawa method) and the calculated reaction orders were 0.93 and 0.95, respectively. The curing reaction follows first-order kinetics. The heat resistance of the SB blended resin was also studied. TGA in nitrogen and air showed that the temperature for 5% mass loss (T_d5) and the residual mass at 1 000℃ decreased with increasing content of A-PBZ resin, but the SB blended resin still exhibited excellent heat resistance.