| 真空直流溅射镀膜的条件分析 |
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| 引用本文： | 黄伟其,宋源.真空直流溅射镀膜的条件分析[J].贵州科学,2011,29(2):1-4. |
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| 作者姓名： | 黄伟其 宋源 |
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| 作者单位： | 贵州大学理学院,贵阳,550025 |
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| 摘 要： | 由真空直流溅射镀膜所得到的样品表面薄膜质量受到镀膜条件的影响，这些条件包括镀膜的氛围和直流电压，其中的惰性气体如氢气的气压控制是致关重要的，这2个参量对离子流的影响是很明显的。在试验中，对离子流与这2个参量的关系进行了定量分析，从而确定出镀膜条件的影响规律，找到最佳的镀膜条件。我们还采用了在样品表面加圆柱环的方法来控制等离子流溅射方向从而使镀膜均匀。
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| 关 键 词： | 真空 溅射 镀膜条件 |
Analysis of Conditions on Sputter Deposition |
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| HUANG Wei-qi,SONG Yuan.Analysis of Conditions on Sputter Deposition[J].Guizhou Science,2011,29(2):1-4. |
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| Authors: | HUANG Wei-qi SONG Yuan |
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| Institution: | (Institute of Nanophotonic Physics,Guizhou University, Guiyang,Guizhou 550025,China) |
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| Abstract: | Surface film quality depends on conditions in sputtering process. These conditions include DC voltage and atmosphere of coating (such as argon) whose influence for the quality is very obvious. In the experiment with the two parameters of the conditions related to quantitative analysis, we determine the law of the coating conditions and find the best coating conditions. We also adopt a method to make the surface of the sample with cylindrical ring to control flow direction of sputtering ion for coating for coating. |
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| Keywords: | vacuum conditions of coating sputter |
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