| 湿度对嵌入元器件印制板绝缘材料的影响 |
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| 引用本文： | 王怀群. 湿度对嵌入元器件印制板绝缘材料的影响[J]. 科学技术与工程, 2013, 13(17): 4941-4945,5025 |
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| 作者姓名： | 王怀群 |
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| 作者单位： | 北京工业职业技术学院 |
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| 基金项目： | 北京市教育委员会科研基地项目(110601203)资助 |
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| 摘 要： | 印制板内嵌入元器件是提高电子安装密度的又一途径,但嵌入元件对印制板的绝缘性提出更高的要求。在简单介绍元器件嵌入印制板的同时,重点是以制作印制板用的纸基树脂(芳纶/环氧复合材料)等绝缘材料为试料,探讨温度和湿度对印制板绝缘材料中空间电荷行为的影响。
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| 关 键 词： | 嵌入元器件 印制板 绝缘材料 空间电荷 纸基树脂 |
| 收稿时间： | 2013-02-21 |
| 修稿时间： | 2013-03-10 |
Effects of Temperature and Humidity on Embedded Components PCB Insulating Material |
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| Wang huai-qun. Effects of Temperature and Humidity on Embedded Components PCB Insulating Material[J]. Science Technology and Engineering, 2013, 13(17): 4941-4945,5025 |
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| Authors: | Wang huai-qun |
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| Affiliation: | WANG Huai-qun(Beijing Polytechnic College,Beijing 100042,P.R.China) |
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| Abstract: | Printed Circuit Board(PCB) embedded components is another way to increase the density of the electronic installation. Meanwhile, the embedded components put forward higher requirements on the printed circuit board insulation. In this paper, the embedded components PCB is briefly introduced. And then, taking the paper-based resin(kevlar / epoxy composites) used in PCB production as sample, the impact of temperature and humidity to the space charge behavior in PCB insulating material is emphatically discussed. |
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| Keywords: | embedded components printed circuit board insulating material space charge paper-based resin |
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