| 高速印刷电路板间完整通孔的全波特性分析 |
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| 引用本文： | 马德贵,任志军,孙玉发. 高速印刷电路板间完整通孔的全波特性分析[J]. 河南科技大学学报(自然科学版), 2009, 30(1) |
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| 作者姓名： | 马德贵 任志军 孙玉发 |
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| 作者单位： | 1. 安徽大学,电子科学与技术学院,安徽,合肥,230039;安徽农业大学,工学院,安徽,合肥,230036
2. 安徽大学,电子科学与技术学院,安徽,合肥,230039 |
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| 基金项目： | 国家自然科学基金，安徽农业大学校长青年基金 |
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| 摘 要： | 首先将完整通孔分解成内部结构和外部结构,再将外部结构分解成短路问题和天线问题,内部结构分解成多个单层垂直通孔.分别对各分解部分进行全波分析,并根据各部分连接端口处的电流连续性条件将所有分解结构连接起来,实现对完整通孔的全波特性分析.给出了三种不同通孔结构的散射参数与损耗,并分析了损耗产生的原因.
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| 关 键 词： | 印刷电路板 通孔 全波特性 双面通孔 垂直通孔 |
Full Wave Characterization Analysis of Entire Vias in High Speed Printed Circuit Board |
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| MA De-Gui,REN Zhi-Jun,SUN YU-Fa. Full Wave Characterization Analysis of Entire Vias in High Speed Printed Circuit Board[J]. Journal of Henan University of Science & Technology:Natural Science, 2009, 30(1) |
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| Authors: | MA De-Gui REN Zhi-Jun SUN YU-Fa |
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| Affiliation: | 1.School of Electronic Science & Technology;Anhui University;Hefei 230039;China;2.School of Engineering;Anhui Agricultural University;Hefei 230036;China |
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| Abstract: | The entire via is decomposed into exterior structure and interior structure.Then the exterior structure is decomposed into short circuit and wire antenna problems,and the interior structure is decomposed into several single-layer vertical vias.Different full wave analyses are used in different decomposed parts separately.Full wave charaterization analysis of the entire via is completed when all decomposed parts are related by continuity of corresponding electric currents.The scattering matrix and loss compa... |
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| Keywords: | Printed circuit board Vias Full wave characterization Hole via Vertical via |
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