模糊层次分析技术（FAHP）在3D锡膏检测中的应用

随着当今先进工艺趋向于使用更小的元件，人们认识到仅仅计算体积已不足以确保工艺质量，锡膏检测仪（SPI），特别是3DSPI在测试策略中扮演起越来越重要的角色。3D锡膏检测仪中经常遇到的激光阴影效应，传统的SPI技术，激光三角法和莫尔（Moiré）技术也都存在或多或少的阴影效应问题。本文首先介绍和分析了激光三角法以及莫尔（Moiré）技术在锡膏检测技术中的应用，它们遇到的主要问题。然后，结合传统方法的优点，提出一种新的方法：模糊层次分析技术（FAHP），从软件硬件两个角度更好的解决3D锡膏检测仪遇到的阴影效应问题，保证更准确地测量结果和更直观的用户界面，使人们可以从工艺的角度出发来管理生产线的质量并具备整合系统的能力。

Application of FAHP Technology to 3D SPI

With the advanced technology of today tend to use smaller components,it is recognized that only the volume calculation process has been insufficient to ensure the quality of solder paste detector （SPI）, in particular testing strategy in 3D SPI starting to play an increasingly important role. 3D SPI often encountered in the shadow effect. The traditional SPI technology,laser triangulation and Moire （Moiré） technology are also more or less the shadow effect of the existence of the problem. This paper introduced and analyzed the laser triangulation Moire （Moiré） detection technology in the solder paste application,the main problems they encountered,and then,combined with the advantages of traditional methods,a new approach：FAHP technology （FAHP） ,both from the software and hardware 3D SPI point of view paste better solu- tion encountered in the shadow of detector effects, and ensure more accurate results and a more intuitive user interface, so that people will manage the quality of the production line from the point of view of technology and have the ability to integrate systems.