| A356铝合金半固态成形的数值模拟 |
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| 引用本文： | 路贵民,赵大志,王平,崔建忠.A356铝合金半固态成形的数值模拟[J].东北大学学报(自然科学版),2007,28(3):353-356. |
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| 作者姓名： | 路贵民 赵大志 王平 崔建忠 |
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| 作者单位： | 东北大学,材料电磁过程研究教育部重点实验室,辽宁,沈阳,110004 |
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| 摘 要： | 利用ANSYS有限元模拟软件,通过对温度场与速度场的耦合数值模拟,分析了触变成形过程中充型温度对A356合金半固态浆料流动及温度分布的影响.模拟结果表明:当充型温度为590℃,压射速度为5 m/s时,半固态浆料充型平稳,没有形成喷溅和卷气现象,温度分布没有明显的热节区域形成,半固态浆料成形效果最理想,有利于获得充型完整、轮廓清晰、内部组织致密的半固态成形件.通过实验对数值模拟所获得的工艺参数进行了验证.
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| 关 键 词： | 半固态成形 数值模拟 温度场 充型温度 凝固 充型过程 |
| 文章编号： | 1005-3026（2007）03-0353-04 |
| 收稿时间： | 2006-03-27 |
| 修稿时间： | 2006-03-27 |
Numerical Simulation of Semi-solid Forming Process of A356 Alloy |
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| LU Gui-min,ZHAO Da-zhi,WANG Ping,CUI Jian-zhong.Numerical Simulation of Semi-solid Forming Process of A356 Alloy[J].Journal of Northeastern University(Natural Science),2007,28(3):353-356. |
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| Authors: | LU Gui-min ZHAO Da-zhi WANG Ping CUI Jian-zhong |
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| Institution: | Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China. |
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| Abstract: | The FEA software ANSYS was applied to the numerical simulation coupling temperature field with velocity field to analyze the effect of mold filling temperature on the flow and temperature distribution of semi-solid slurry of A356 alloy during thixo-forming. The results showed that the semi-solid slurry is stable in filling process without spouting, air entrapment and hot spot area found in temperature distribution if the mold filling temperature is 590°C with an injecting rate 5 m/s. Such conditions are ideal to the forming of semi-solid A356 alloy slurry because they are beneficial to getting fully filled semi-solid parts with clear contour and compact microstructure. The technological parameters obtained from numerical simulation are verified by tests. |
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| Keywords: | semi-solid forming numerical simulation temperature field mold filling temperature solidification mold filling process |
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