首页 | 本学科首页   官方微博 | 高级检索  
     

小尺寸延期装置性能影响因素的数值模拟
引用本文:苗艳玲,乔小晶. 小尺寸延期装置性能影响因素的数值模拟[J]. 北京理工大学学报, 2012, 32(9): 895-899
作者姓名:苗艳玲  乔小晶
作者单位:北京理工大学机电学院,北京100081;北京工业大学科技处,北京100124;北京理工大学机电学院,北京,100081
摘    要:针对延期药长秒量和延期装置小型化的要求,采用烟火药剂爆发点比较计算方法,利用Ansys软件对小尺寸的延期装置在不同的环境温度下、有无绝缘套管以及不同绝缘套管厚度下的热传导进行模拟,并对延期时间进行了计算.模拟结果表明,对于隔板延期装置,隔板输出端中心点的热传导速度大于隔板边缘点的热传导速度;装绝缘套管延期装置的延期时间比不装绝缘套管的延期时间长;但当内直径为2mm,绝缘套管厚度为1mm时,延期装置出现熄火现象;延期装置的延期时间随外界环境温度的降低而增长,但当外界环境温度低至-30℃和-40℃时,会出现熄火现象.

关 键 词:隔板  延期  热传导
收稿时间:2011-11-10

Numerical Simulation to Investigate the Performance of Delay Equipment with Tungsten Delay Composition
MIAO Yan-ling and QIAO Xiao-jing. Numerical Simulation to Investigate the Performance of Delay Equipment with Tungsten Delay Composition[J]. Journal of Beijing Institute of Technology(Natural Science Edition), 2012, 32(9): 895-899
Authors:MIAO Yan-ling and QIAO Xiao-jing
Affiliation:School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China;Department of Science and Technology, Beijing University of Technology, Beijing 100124, China;School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Abstract:To meet the demands of long delay time in second level for small size delay equipment,Ansys software was used to simulate the heat transfer of delay equipment and calculate the delay time.The influence of working conditions on performance of delay equipment was investigated for comparison,including different environmental temperatures and different thicknesses of insulating sleeve.The results show that the speed of heat transfer at the central point of the clapboard is faster than that at the edge of the clapboard.The delay time of the equipment with an insulating sleeve is longer than that without insulating sleeve,while the inner diameter of equipment is 2 mm and its thickness of the insulating sleeve is 1 mm,the delay composition cannot be ignited.The lower the environmental temperature is,the longer the delay time,while the environmental temperature decreases to-30 ℃ and-40 ℃,the heat transferred to the right side of the clapboard is much less,where the temperature is lower than the decomposition temperature of the composition so that the delay composition cannot be ignited.
Keywords:clapboard  delay  heat transfer
本文献已被 CNKI 万方数据 等数据库收录!
点击此处可从《北京理工大学学报》浏览原始摘要信息
点击此处可从《北京理工大学学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号