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液相置换沉积制备电器触头用银钨包复粉末
引用本文:陈慧光,张多默,郭学益,刘志宏. 液相置换沉积制备电器触头用银钨包复粉末[J]. 中南大学学报(自然科学版), 1997, 0(4)
作者姓名:陈慧光  张多默  郭学益  刘志宏
作者单位:中南工业大学有色冶金系!长沙,410083
摘    要:在硝酸银氨性溶液中,采用钨粉置换沉积法对电器触头用银钨包复粉末的制备进行了研究,探讨了工艺条件对银包复钨效果的影响.结果表明,在合适的工艺条件下,液相互换沉积是一种制得成分均匀、包复完整的银钨复合粉末十分有效且简单易行的方法.

关 键 词:复合粉末  置换沉积  触头材料

PREPARATION OF SILVER-COATED TUNGSTEN COMPOSITE POWDER BY CEMENTATION IN AQUEOUS SOLUTION
Chen Huiguang, Zhang Duomo, Guo Xueyi, Liu Zhihong. PREPARATION OF SILVER-COATED TUNGSTEN COMPOSITE POWDER BY CEMENTATION IN AQUEOUS SOLUTION[J]. Journal of Central South University:Science and Technology, 1997, 0(4)
Authors:Chen Huiguang   Zhang Duomo   Guo Xueyi   Liu Zhihong
Abstract:In ammonical silver nitrate solution, the research was done on silver-coated tungsten composite powders preparation which could be used in electrical contact manufacture by cementation of tungsten powder.The effect of processing conditions on the deposition of silver upon tungsten was investigated. The results indicated that the cementation was an effective and simple method to prepare well-covered silver-coated tungsten eomposite powders in uniform composition under proper conditions.
Keywords:composite powder  cementation  electrical contact material  
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