| 电刷镀复合镀层沉积机理探讨 |
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| 引用本文： | 陈嘉真,林伟健,陈靖芯. 电刷镀复合镀层沉积机理探讨[J]. 江苏大学学报(自然科学版), 1991, 0(3) |
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| 作者姓名： | 陈嘉真 林伟健 陈靖芯 |
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| 摘 要： | 本文结合电刷镀镍-钴-二氧化锆复合镀的试验研究,对非金属固体微粒与金属共沉积机理进行了初步探讨,并讨论了表面活性剂、施镀电压、镀液中固体微粒浓度和微粒尺寸等因素对镀层中非金属微粒沉积量的影响.
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| 关 键 词： | 电刷镀 复合镀 沉积 表面活性剂 电压 非金属颗粒 |
Depositing Mechanism of Composite Brush Plating |
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| Chen Jiazheng Lin Weijian Chen Jingxin. Depositing Mechanism of Composite Brush Plating[J]. Journal of Jiangsu University:Natural Science Edition, 1991, 0(3) |
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| Authors: | Chen Jiazheng Lin Weijian Chen Jingxin |
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| Affiliation: | Chen Jiazheng Lin Weijian Chen Jingxin |
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| Abstract: | The mechanism for deposit of non-metallic particles in metal coating is preliminarily investigated in combination with experimental study of Ni-Co-ZrO2 composite coating with brush plating, and also analyzed are the effect of the factors, such as surfactant, voltage, density of particles in solution and particles size on non-metallic particles in metal coating. |
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| Keywords: | brush plating composite plating deposit surfactant voltage non-metallic particle. |
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