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功率半导体器件风冷散热器热阻计算
引用本文:周涛,陆晓东,李媛.功率半导体器件风冷散热器热阻计算[J].渤海大学学报(自然科学版),2011,32(3):228-235.
作者姓名:周涛  陆晓东  李媛
作者单位:渤海大学工学院,辽宁锦州,121013
基金项目:辽宁省教育厅高等学校科研项目计划(No:L2010002)
摘    要:基于散热器工作过程分析,提出一种新型的计算功率器件用散热器热阻的计算方法。计算过程中,先将散热器的传热过程分为体内传热过程和表面散热两部分,然后详细分析了每一过程,并给出描述每一散热过程的基本公式。最后利用散热器厂家给出的实测热阻曲线进行验证。计算结果表明,这种计算散热器热阻的方法具有简单、快捷、准确的特点。

关 键 词:功率半导体器件  散热器  热阻  计算  模拟

Calculation of thermal resistance for air-cooling heat sink of power semiconductor parts
ZHOU Tao,LU Xiao-dong,LI Yuan.Calculation of thermal resistance for air-cooling heat sink of power semiconductor parts[J].Journal of Bohai University:Natural Science Edition,2011,32(3):228-235.
Authors:ZHOU Tao  LU Xiao-dong  LI Yuan
Institution:ZHOU Tao,LU Xiao-dong,LI Yuan (College of Technology,Bohai University,Jinzhou 121013,China)
Abstract:By an analysis of the operation of heat sink,a new method is proposed for the calculation of thermal resistance for air-cooling heat sink of power semiconductor parts.For the calculation,there are 2 steps: internal heat transmission and the surface heat diffusion.The basic formulae for each step are provided,and the results are verified by using the heat sink thermal resistance curve provided by the manufacturer.The calculation result shows that this method is easy and accurate.
Keywords:power semiconductor parts  heat sink  thermal resistance  calculation  simulation  
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