| Modeling Chemical Mechanical Polishing with Couple Stress Fluids |
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| 引用本文： | 张朝辉 雒建斌 温诗铸. Modeling Chemical Mechanical Polishing with Couple Stress Fluids[J]. 清华大学学报, 2004, 9(3): 270-273 |
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| 作者姓名： | 张朝辉 雒建斌 温诗铸 |
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| 作者单位： | StateKeyLaboratoryofTribology,DepartmentofPrecisionInstrumentsandMechanology,TsinghuaUniversity,Beijing100084,China |
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| 基金项目： | Supported by the National Natural Science Foundation of China (major program，No. 50390060) and the Postdoctoral Fund of China |
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| 摘 要： | Chemical mechanical polishing (CMP) is a manufacturing process used to achieve high levels of global and local planarity. Currently, the slurries used in CMP usually contain nanoscale particles to accelerate the removal ratio and to optimize the planarity, whose rheological properties can no longer be accurately modeled with Newtonian fluids. The Reynolds equation, including the couple stress effects, was derived in this paper. The equation describes the mechanism to solve the CMP lubrication equation with the couple stress effects. The effects on load and moments resulting from the various parameters, such as pivot height, roll angle, and pitch angle, were subsequently simulated. The results show that the couple stress can provide higher load and angular moments. This study sheds some lights into the mechanism of the CMP process.
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| 关 键 词： | 化学机械抛光 耦合压力流 润滑方程 抛光机理 平面性 |
Modeling Chemical Mechanical Polishing with Couple Stress Fluids |
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| ZHANG Chaohui,LUO Jianbin ),WEN Shizhu State Key Laboratory of Tribology. Modeling Chemical Mechanical Polishing with Couple Stress Fluids[J]. Tsinghua Science and Technology, 2004, 9(3): 270-273 |
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| Authors: | ZHANG Chaohui LUO Jianbin ) WEN Shizhu State Key Laboratory of Tribology |
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| Affiliation: | ZHANG Chaohui,LUO Jianbin )**,WEN Shizhu State Key Laboratory of Tribology,Department of Precision Instruments and Mechanology,Tsinghua University,Beijing 100084,China |
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| Abstract: | Chemical mechanical polishing (CMP) is a manufacturing process used to achieve high levels of global and local planarity. Currently, the slurries used in CMP usually contain nanoscale particles to accel-erate the removal ratio and to optimize the planarity, whose rheological properties can no longer be accu-rately modeled with Newtonian fluids. The Reynolds equation, including the couple stress effects, was de-rived in this paper. The equation describes the mechanism to solve the CMP lubrication equation with the couple stress effects. The effects on load and moments resulting from the various parameters, such as pivot height, roll angle, and pitch angle, were subsequently simulated. The results show that the couple stress can provide higher load and angular moments. This study sheds some lights into the mechanism of the CMP process. |
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| Keywords: | chemical mechanical polishing couple stress lubrication equation polishing mechanism |
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