首页 | 本学科首页   官方微博 | 高级检索  
     检索      

微量铈离子在酸性电镀锡过程中沉积机理的探讨
引用本文:严怡芹,倪光明.微量铈离子在酸性电镀锡过程中沉积机理的探讨[J].安徽师范大学学报(自然科学版),1994,17(4):46-51.
作者姓名:严怡芹  倪光明
摘    要:本文根据实验结果分析、讨论了微量稀土金属铈离子在酸性电镀锡过程中的沉积机理。初步认为是:吸附欠电电位沉积机理。

关 键 词:铈离子  镀锡  沉积机理

Research on the micro-Cerium ion deposition mechanism in the process of acidic electroplating tin
Yan Yiqin, Ni Guangming.Research on the micro-Cerium ion deposition mechanism in the process of acidic electroplating tin[J].Journal of Anhui Normal University(Natural Science Edition),1994,17(4):46-51.
Authors:Yan Yiqin  Ni Guangming
Institution:Department of Chemistrg
Abstract:In the paper. the micro-rear earth metal cerium ion deposition mechanism in the process of acidic electroplating tin was analysed and discussed by using the experimental results. It belongs to absorb underpotential deposition mechanism.
Keywords:Cerium ion  electroplate tin  underpotential deposition mechanism  
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号