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三维热传导型半导体器件瞬态问题的修正迎风差分格式
引用本文:崔明荣. 三维热传导型半导体器件瞬态问题的修正迎风差分格式[J]. 山东大学学报(理学版), 2002, 37(3): 189-193
作者姓名:崔明荣
作者单位:山东大学数学与系统科学学院,济南,250100
基金项目:国家自然科学基金资助项目 (19972 0 3 9,10 0 710 44 )
摘    要:考虑了三维传热导型半导体器件瞬态问题,对电场位势和热传导方程给出中心差分格式,对电子和空穴浓度方程给出修正的隐式迎风差分格式,利用线性外推处理不同时间步长,并证明了格式的收敛性。

关 键 词:半导体 三维热传导 迎风差分格式 线性外推 误差估计
文章编号:0559-7234(2002)03-0189-05
修稿时间:2001-08-30

THE MODIFIED UPWIND FINITE DIFFERENCE METHOD FOR THREE DIMENSIONAL PROBLEM FOR THE TRANSIENT BEHAVIOR OF SEMICONDUCTOR WITH HEAT CONDUCTION
CUI Ming rong. THE MODIFIED UPWIND FINITE DIFFERENCE METHOD FOR THREE DIMENSIONAL PROBLEM FOR THE TRANSIENT BEHAVIOR OF SEMICONDUCTOR WITH HEAT CONDUCTION[J]. Journal of Shandong University, 2002, 37(3): 189-193
Authors:CUI Ming rong
Abstract:The three dimensional problem for the transient behavior of semiconductor with heat conduction is considered.Central difference schemes for the electric potential and heat conduction equations with implicit modified upwind difference schemes for the electron and hole concentration equations are provided.Linear extrapolations are used to treat different time steps.Convergence of the schemes are proved.
Keywords:Semiconductor  three dimensional heat conduction  upwind difference scheme  linear extrapolation  error estimate
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