| ABS表面化学镀Cu／Ni－P的电磁屏蔽功能 |
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| 引用本文： | 张丽芳,刘金玲,李文明,任宝林,石殿普. ABS表面化学镀Cu／Ni－P的电磁屏蔽功能[J]. 吉林大学学报(理学版), 1996, 0(3) |
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| 作者姓名： | 张丽芳 刘金玲 李文明 任宝林 石殿普 |
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| 作者单位： | 吉林大学包装工程系 |
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| 摘 要： | 在ＡＢＳ塑料表面以化学镀沉积ＣＵ／Ｎｉ－Ｐ双镀层，并探讨其与基体的结合强度、环境稳定性、导电性及电磁屏蔽性能；以ＳＥＭ观察了镀层的微结构及表观形貌．研究结果表明，ＡＢＳ／Ｃｕ／Ｎｉ－Ｐ材料具有较高的电磁屏蔽效率，且经久耐用．
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| 关 键 词： | 电磁屏蔽，化学镀Cu／Ni－P双镀层，ABS塑料 |
Electromagnetic Shielding Effect of Electroless Copper/Nickel--Phosphorus on ABS Surface |
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| Zhang Li fang,Liu Jiming,Li Wenming,Ren Baolin,Shi Dianpu. Electromagnetic Shielding Effect of Electroless Copper/Nickel--Phosphorus on ABS Surface[J]. Journal of Jilin University: Sci Ed, 1996, 0(3) |
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| Authors: | Zhang Li fang Liu Jiming Li Wenming Ren Baolin Shi Dianpu |
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| Abstract: | The present paper deals with deposition of the bilayer on ABS surface by means of electroless and the attaching intensity with the substrate (ABS), environmental stability, conductivity, and electromagnetic shielding effect of electroless Cu/Ni--P bilayer on ABS surface in detail. The microstructure and the apparent morphology of the bilayer on ABS plastic surface were obserred bymeans of SEM. The results showed that ABS/Cu/Ni--P bilayer possesses a high electromagnetic shielding effect and is durable. |
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| Keywords: | electromagnetic shielding effect electroless Cu/Ni--P bilayer ABS plastic |
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