| Sn-Cu薄膜的沉积行为及其微观形貌分析 |
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| 引用本文： | 胡炜,谭澄宇,崔航,郑子樵,贺甜.Sn-Cu薄膜的沉积行为及其微观形貌分析[J].中南大学学报(自然科学版),2011,42(4). |
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| 作者姓名： | 胡炜 谭澄宇 崔航 郑子樵 贺甜 |
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| 作者单位： | 1. 中南大学有色金属材料科学与工程教育部重点实验室,湖南长沙,410083;三一重工股份有限公司,湖南长沙,410100
2. 中南大学有色金属材料科学与工程教育部重点实验室,湖南长沙,410083 |
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| 摘 要： | 利用电沉积法,在酸性镀液中制得Sn-Cu薄膜,采用扫描电子显微镜(SEM)及能谱仪(EDS)研究镀液中主盐浓度、电镀工艺条件及添加剂对薄膜形貌的影响,并借助循环伏安曲线研究不同条件对Sn-Cu沉积行为的影响.研究结果表明:镀液中主盐浓度的增大促进了Sn-Cu的还原沉积;添加剂的引入对金属离子具有较强的螯合作用,限制了镀液中自由金属离子的浓度,使得合金沉积电位负移;此外,镀液中Sn2+浓度变化对镀层晶粒粒度影响较大,改变Cu2+浓度对镀层的平整度影响较大;电流密度增加、温度降低及加入添加剂,都能细化镀层晶粒.
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| 关 键 词： | 电沉积 可焊性镀层 Sn-Cu薄膜 循环伏安 |
Analysis of Sn-Cu films deposition behaviors and micromorphologies |
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| HU Wei,TAN Cheng-yu,CUI Hang,ZHENG Zi-qiao,HE Tian.Analysis of Sn-Cu films deposition behaviors and micromorphologies[J].Journal of Central South University:Science and Technology,2011,42(4). |
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| Authors: | HU Wei TAN Cheng-yu CUI Hang ZHENG Zi-qiao HE Tian |
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| Institution: | HU Wei1,2,TAN Cheng-yu 1,CUI Hang1,ZHENG Zi-qiao1,HE Tian1 (1.Educational Key Laboratory of Non-ferrous Metal Materials Science and Engineering,Central South University,Changsha 410083,China,2.SANY Heavy Industry Co.Ltd,Changsha 410100,China) |
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| Abstract: | Sn-Cu films were prepared by electrodeposition.The effect of the concentrations of main salts,the process conditions and additives on the morphologies of Sn-Cu films were investigated by scanning electron microscopy(SEM) and energy disperse spectroscopy(EDS),and the effect of various conditions on electrodeposition of Sn-Cu was investigated by cyclic voltammetry(CV).The results indicate that the increase of main salts concentrations promotes Sn-Cu reduction deposition.The addition of additives holds metal i... |
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| Keywords: | electrodeposition solderable coating Sn-Cu film cyclic voltammetry |
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