| 基于单轴微拉伸的TSV铜力学性能研究 |
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| 引用本文： | 李君翊,汪红,王溯,王慧颖,程萍,张振杰,丁桂甫. 基于单轴微拉伸的TSV铜力学性能研究[J]. 复旦学报(自然科学版), 2012, 51(2): 184-189,262,263 |
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| 作者姓名： | 李君翊 汪红 王溯 王慧颖 程萍 张振杰 丁桂甫 |
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| 作者单位： | 1. 微米／纳米加工技术国家重点实验室,上海200240／上海交通大学微纳科学技术研究院,上海200240
2. 上海新阳半导体材料股份有限公司,上海,201616 |
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| 基金项目： | 科技部重大专项基金资助项目，国家自然科学基金资助项目 |
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| 摘 要： | 电子产品的微型化趋势使芯片的三维集成概念应运而生,并通过硅通孔(TSV-through silicon via)技术得以实现.为了测试TSV中互连铜(Cu-TSV)的力学性能,提出了1个简便、易于操作的单轴微拉伸方法.利用有限元分析优化设计Cu-TSV微拉伸试样的支撑框架结构,有效减小试样在制作及操作过程中的损伤;种子层采用溅射Ti膜取代传统的溅射Cr/Cu膜,减小了电镀过程中的应力,避免了对种子层碱性刻蚀时对试样的腐蚀;采用单轴微拉伸系统对优化设计与制备的Cu-TSV微拉伸试样进行测试.经测试得到的Cu-TSV的杨氏模量与抗拉强度为25.4～32.9GPa和574～764MPa.
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| 关 键 词： | 硅通孔 互连铜 微拉伸 微观力学性能 |
Investigation of Mechanical Properties of Cu-TSV by Uniaxial Micro-tensile Test |
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| LI Jun-yi,WANG Hong,WANG Su,WANG Hui-ying,CHENG Ping,ZHANG Zhen-jie,DING Gui-fu. Investigation of Mechanical Properties of Cu-TSV by Uniaxial Micro-tensile Test[J]. Journal of Fudan University(Natural Science), 2012, 51(2): 184-189,262,263 |
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| Authors: | LI Jun-yi WANG Hong WANG Su WANG Hui-ying CHENG Ping ZHANG Zhen-jie DING Gui-fu |
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| Affiliation: | 1,2(1.National Key Laboratory of Science and Technology on Nano/Micro Fabrication,Shanghai 200240,China; 2.Shanghai Jiao Tong University,Research Institute of Micro/Nano Science and Technology,Shanghai 200240, China;3.Shanghai Sinyang Semiconductor Materials Co.,Ltd,Shanghai 201616,China) |
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| Abstract: | The miniaturization trend of microelectric products gives birth to 3D stacking of chips,which is realized by using TSV(through silicon via) technique.A novel micro-tensile specimen of the uniaxial micro-tensile test for measuring the mechanical properties of Cu-TSV is proposed.Finite-Element Method(FEM) has been used to optimize the design of the supporting frame of the sample with a Cu-TSV thin film,which can effectively reduce the damage ratio of the sample during operations.The surface-treated Ti seed layer has substituted for the traditional Cr/Cu seed layer to reduce the stress concentration and prevent the specimen from alkali corrosion when etching the seed layer.The samples have been tested by the uniaxial micro-tensile system to obtain the mechanical properties of the Cu-TSV thin film.The measured Young’s modulus and the ultimate tensile strength of Cu-TSV is 25.4—32.9 GPa and 574—764 MPa,respectively. |
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| Keywords: | TSV Cu-TSV micro-tensile test micro-mechanical properties |
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