| 电镀镍金板无法键合金线的失效分析 |
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| 引用本文： | 陈飞珺,严石,杨振国,李志东,陈蓓.电镀镍金板无法键合金线的失效分析[J].复旦学报(自然科学版),2012,51(2):154-158,261,265. |
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| 作者姓名： | 陈飞珺 严石 杨振国 李志东 陈蓓 |
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| 作者单位： | 1. 复旦大学材料科学系,上海,200433
2. 深圳市兴森快捷电路科技股份有限公司,深圳,518057 |
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| 摘 要： | 印制电路板(Printed Circuit Board,PCB)广泛用于各类电子产品,以实现元器件间的电气导通和信号传输.引线键合起着封装内部芯片和外部管脚以及芯片间的电气连接作用,且工艺简单成本较低,广为采用.现介绍了1批电镀镍金PCB板表面无法键合金线的失效概况,然后通过三维体式显微镜、扫描电镜(SEM)、能谱分析(EDS)等宏微观测试方法和表征手段,对失效样品进行了系统分析,发现金线键合不上是由镀金层太薄且硬脆引起,对预防相应失效提出了解决的建议.
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| 关 键 词： | 电镀镍金 键合 金线 失效分析 |
Failure Analysis of Debonding of Gold on Electrolytic Nickel and Gold |
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| CHEN Fei-jun,YAN Shi,YANG Zhen-guo,LI Zhi-dong,CHEN Bei.Failure Analysis of Debonding of Gold on Electrolytic Nickel and Gold[J].Journal of Fudan University(Natural Science),2012,51(2):154-158,261,265. |
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| Authors: | CHEN Fei-jun YAN Shi YANG Zhen-guo LI Zhi-dong CHEN Bei |
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| Institution: | 1.Department of Materials Science,Fudan University,Shanghai 200433,China; 2.Shenzhen Fastprint Circuit Technology Co.,Ltd,Shenzhen 518057,China) |
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| Abstract: | Printed Circuit Board is widely used in all kinds of electronic products to realize the electrical connection and signal transmission between components and devices on the board.Wire bonding serves as the electrical connection between internal chips and external pins.It has the advantages of simple process and low cost thus it has been widely used.The general failure of debonding gold of a set of electrolytic nickel and aurum PCB is first introduced.Then by techniques of three-dimensional stereo microscope,scanning electron microscope(SEM),energy dispersive spectroscopy(EDS),the samples are studied and analyzed.It was found that the debonding of gold is due to the inadequate thickness of electrolytic gold on Nickel and its brittleness.Corresponding solutions and suggestions are proposed to prevent such type of failure. |
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| Keywords: | electrolytic nickel and aurum bonding gold wire failure analysis |
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