| 相图计算及其在无铅焊接材料中的应用 |
| |
| 引用本文： | 高峰,王翠萍,刘兴军.相图计算及其在无铅焊接材料中的应用[J].上海交通大学学报,2007(Z2). |
| |
| 作者姓名： | 高峰 王翠萍 刘兴军 |
| |
| 作者单位： | 厦门大学材料科学与工程系 厦门361005 |
| |
| 摘 要： | 随着Sn-Pb焊接材料在电子工业中的应用限制,无铅焊接材料的设计与开发已经是电子封装领域的重要课题.相图计算方法(CALPHAD)作为一种科学研究方法也越来越多的应用到材料的设计开发和工艺研究方面.相图计算主要是依据实验数据,建立热力学模型,根据Gibbs自由能最小原理计算相平衡.主要介绍了相图计算原理,以及根据已经评估的热力学数据,相图计算方法在无铅焊接材料的设计开发、焊接过程的界面反应、焊接凝固模拟等方面的应用.
|
| 关 键 词： | 无铅焊接 相图计算 Gibbs自由能 界面反应 |
CALPHAD Method and Its Applications in Pb-Free Solders |
| |
| GAO Feng,WANG Cui-ping,LIU Xing-jun.CALPHAD Method and Its Applications in Pb-Free Solders[J].Journal of Shanghai Jiaotong University,2007(Z2). |
| |
| Authors: | GAO Feng WANG Cui-ping LIU Xing-jun |
| |
| Abstract: | The development of Pb-free solders is very important in the electronic industries,as the restricting of the Pb in solders.Calculation phase diagram (CALPHAD) has been used to design the materials and study the technics of production.CALPHAD is the method for calculation of the phase equilibria based on the experimental data,thermodynamic models and the minimisation of Gibbs free energy.This paper introduced the principle of CALPHAD and its applications in Pb-free soldering,which include the designing of the solders,the prediction of the interface reaction,and the solidification of solders. |
| |
| Keywords: | Pb-free soldering calculation phase diagram Gibbs free energy interface reaction |
| 本文献已被 CNKI 等数据库收录！ |
|
