| 热障涂层热不匹配残余应力的分析研究 |
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| 引用本文： | 白玉梅,赖明荣. 热障涂层热不匹配残余应力的分析研究[J]. 科学技术与工程, 2011, 11(14): 3126-3129 |
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| 作者姓名： | 白玉梅 赖明荣 |
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| 作者单位： | 1. 西北工业大学机电学院,西安,710072
2. 太原理工大学机械工程学院,太原,030024 |
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| 基金项目： | 国家自然科学基金项目（面上项目，重点项目，重大项目） |
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| 摘 要： | 广泛应用于高温部件的热障涂层,在热载荷作用下各层间所集聚的残余应力是导致其层裂和失效的重要原因。针对热障涂层由于热不匹配产生的残余应力,建立了相应的平面应变模型,研究了温度与涂层厚度对界面残余应力和陶瓷层内最大残余应力分布的影响。结果表明,陶瓷层内的残余应力主要表现为横向压缩应力,且最大值位于距陶瓷层表面1/3厚度处;界面残余应力相对较小,但在自由边界处有应力集中现象;随着温度的升高应力值在增大,陶瓷层厚度增加会改变结构厚度方向上的应力分布,且厚度增加使陶瓷层内残余应力值和界面残余应力值减小。
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| 关 键 词： | 热障涂层 残余应力 界面应力 |
| 收稿时间： | 2011-02-24 |
| 修稿时间： | 2011-02-24 |
Analysis of Residual Stresses in Thermal Barrier Coating Due to Thermal Mismatch |
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| baiyumei and laimingrong. Analysis of Residual Stresses in Thermal Barrier Coating Due to Thermal Mismatch[J]. Science Technology and Engineering, 2011, 11(14): 3126-3129 |
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| Authors: | baiyumei and laimingrong |
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| Affiliation: | Tai Yuan University of Technology |
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| Abstract: | Thermal barrier coating(TBC) has been used widely in heat components,the residual stress concentrated by thermal load can lead to spalling or failure for the entire coating system.A plane strain geometrical model of thermal barrier coating(TBC) is established in order to investigate the effects of temperature and ceramic thickness on the distributed characters of maximal residual stresses in ceramic and interfacial ones.The results show that the stress in ceramic layer is mainly for lateral compressive one,... |
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| Keywords: | thermal barrier coating (TBC) residual stress interfacial stress |
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