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| 塑料封装抗潮性评估试验方法 | |
| 引用本文： | 茅有福,张蓓榕,饶祖广.塑料封装抗潮性评估试验方法[J].华东师范大学学报(自然科学版),1988(4). |
| 作者姓名： | 茅有福 张蓓榕 饶祖广 |
| 作者单位： | 华东师范大学电子科学技术系 (茅有福，张蓓榕)，华东师范大学电子科学技术系(饶祖广) |
| 摘 要： | 用铝金属梳状测试结构测量表面电流的方法和压力锅试验对塑封器件的抗潮性进行评估,对试验结果和失效原因作了分析和讨论. |
| 关 键 词： | 测试结构 高压锅试验 塑封器件抗潮性 二氧化硅表面电导率 失效分析 |
Evaluation Test for Moisture Resistance of Plastic Encapsulation |
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| MAOSYOTJFU, ZHANG BEIRONG, RAO ZUGUANG.Evaluation Test for Moisture Resistance of Plastic Encapsulation[J].Journal of East China Normal University(Natural Science),1988(4). | |
| Authors: | MAOSYOTJFU ZHANG BEIRONG RAO ZUGUANG |
| Institution: | Department of Electronic Science awl Technology |
| Abstract: | Using the aluminum metallization comb test structure for measurement of the surface current on the chip and the pressure cooker test (PCT), the moisture resistance of plastic encapsulated devices is evaluated.The test results and failure reason are analyzed and discussed. |
| Keywords: | test structure pressure cooker test (POT) moisture resistance of plastic encapsulated devices SiO surface conductivity failure analysis |
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