电热式化学镀铜地热地板的表面化学结构与导热性

用X射线光电子能谱及激光导热性能测试仪测试化学镀铜杨木单板的表面化学结构及其复合后地热地板的导热性.结果表明:镀铜后杨木单板的Cu元素与其复合后的地热地板导热率呈正相关关系;镀层中Cu元素以Cu~(2+)的形式存在,随着施镀时间的增加,Cu~+的歧化反应更加完全,CuOH与Cu_2O逐渐还原为金属Cu;在相同含水率条件下,镀铜地热地板复合材料的导热率比全素复合材料的导热率高2倍多,且随着施镀时间的增加,其导热率也随之增大.

Surface Chemical Structure and Thermal Conductivity of Electrothermal Electroless Copper Plating Geothermal Floor

In order to provide references for electroless copper plating geothermal floor multilayer composites(ECPF) in practical applications,surface chemical structure of electroless copper plating poplar veneer(ECPV) and thermal conductivity of multilayer composites of ECPV were studied by X-ray photoelectron spectroscopy and laser thermal conductivity tester.The results were as follows:the Cu element of ECPV has a positive correlation with the thermal conductivity of the composite geothermal floor.The Cu element is present in the form of Cu2+ in copper coating.The dismutase reaction of Cu+ is more complete,CuOH and Cu2O gradually reduced to metal Cu with the increase of plating time.The thermal conductivity of ECPF is 2 times higher than that of ECPV,and the thermal conductivity increases with the increase of plating time in the same moisture content.