| 电子组装无铅钎料用助焊剂的研究现状及趋势 |
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| 引用本文： | 徐冬霞,雷永平,夏志东,郭福,史耀武.电子组装无铅钎料用助焊剂的研究现状及趋势[J].上海交通大学学报,2007(Z2). |
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| 作者姓名： | 徐冬霞 雷永平 夏志东 郭福 史耀武 |
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| 作者单位： | 北京工业大学材料科学与工程学院 北京100022 |
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| 基金项目： | 国家高技术发展计划(863)资助项目(2002AA322040)，北京市自然科学基金资助(2012003) |
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| 摘 要： | 概述了世界电子产品的无铅化趋势及相关立法,比较了世界各国及地区的助焊剂专利文献,分析了助焊剂的研究进展状况,着重论述了微电子组装中无铅钎料专用助焊剂的特点和要求,并提出了开发和研究无铅钎料专用环保型助焊剂需要解决的一些关键问题.最后,归纳了微电子组装无铅钎料专用助焊剂的发展方向和趋势.
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| 关 键 词： | 电子组装 无铅钎料 助焊剂 |
The Current Status and Trends in Research on Soldering Flux for Lead-free Solder in Electronic Assembly |
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| XU Dong-xia,LEI Yong-ping,XIA Zhi-dong,GUO Fu,SHI Yao-wu.The Current Status and Trends in Research on Soldering Flux for Lead-free Solder in Electronic Assembly[J].Journal of Shanghai Jiaotong University,2007(Z2). |
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| Authors: | XU Dong-xia LEI Yong-ping XIA Zhi-dong GUO Fu SHI Yao-wu |
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| Abstract: | This paper summarized the lead-free tendency and its relative legislation of the electronic products in worldwide.Subsistent patent documents and studies of soldering fluxes in different countries and regions were compared.The research status of soldering fluxes was also analyzed.The characteristic and requirement of the soldering fluxes for lead-free solders in microelectronics assembly were described in detail.Some pivotal problems on the development and study of the special soldering fluxes for lead-free solders were put forward,and the fluxes are required to be environmentally friendly.Finally,the trend and prospect of the soldering fluxes for lead-free solders were summed up in microelectronics assembly. |
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| Keywords: | electronics assembly lead-free solder soldering flux |
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