Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers |
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Authors: | Z J PEI X J XIN |
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Institution: | Department of Industrial and Manufacturing Systems Engineering Kansas State University Department of Mechanical and Nuclear Engineering Kansas State University USA |
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Abstract: | Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective... |
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Keywords: | finite element analysis grinding lapping silicon wafer waviness removal |
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