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新型高耐热性环氧树脂的合成和表征
引用本文:许元花,罗梦,彭桦,王曦,苏胜培.新型高耐热性环氧树脂的合成和表征[J].湖南师范大学自然科学学报,2011,34(4):43-50.
作者姓名:许元花  罗梦  彭桦  王曦  苏胜培
作者单位:1. 湖南省资源精细化与先进材料重点实验室,湖南师范大学,中国长沙410081
2. 湖南大学化学化工学院,中国长沙,410081
基金项目:湖南师范大学潇湘学者启动资金资助项目(化050613)
摘    要:利用二甲基双酚基环己烷(DMBPC)和环氧氯丙烷(ECH)在碱性条件下合成了1,1-双(4-羟基-3-甲基苯基)环己烷环氧树脂(DMBPCEP).采用非等温差示扫描量热法(DSC)研究了DMBPCEP/4,4-二氨基二苯甲烷(DDM)体系的固化过程,利用DSC、HDT、TGA和吸水性实验对固化物耐热性和吸湿性进行了分析...

关 键 词:1  1-双(4-羟基-3-甲基苯基)环己烷环氧树脂  固化动力学  固化过程  热性能  吸湿性

Synthesis and Characterization of a Novel High Heat-Resistant Epoxy Resin
XU Yuan-hua,LUO Meng,PENG Hua,WANG Xi,SU Sheng-pei.Synthesis and Characterization of a Novel High Heat-Resistant Epoxy Resin[J].Journal of Natural Science of Hunan Normal University,2011,34(4):43-50.
Authors:XU Yuan-hua  LUO Meng  PENG Hua  WANG Xi  SU Sheng-pei
Institution:XU Yuan-hua1,LUO Meng1,PENG Hua2,WANG Xi1,SU Sheng-pei1(1.Key Lab of Sustainable Resources Processing and Advanced Materials of Hunan Province,Hunan Normal University,Changsha 410081,China,2.College of Chemistry and Chemical Engineering,Hunan University,China)
Abstract:A novel bisphenol epoxy resin prepolymer was synthesized by the reaction of 1,1-bis(4-hydroxy-3-methylphenyl) cyclohexane (DMBPC) with epichlorohydrin (ECH) in the presence of sodium hydroxide.The curing behaviors of the epoxy system consisting of 1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane epoxy resin (DMBPCEP) and 4,4'-diaminodiphenylmethane (DDM) as the curing agent were investigated using differential scanning calorimeter ( DSC),and the thermal properties of obtained cured products were examined by DSC,heat distort temperature (HDT) and thermogravimetric analysis (TGA).The water absorption was also compared with that of the bisphenol A epoxy resin (DGEBA).The calculated results from DSC data showed that the value of the activation energy (Ea) and the curing reaction order (n) are 49.8 kJ/mol and 0.87,respectively,and the optimal curing process was determined.DSC,HDT and TGA analyses and the moisture absorption experimental results indicated that the thermal and water absorption properties of this novel epoxy resin are superior to those of DGEBA.
Keywords:1  1-bis(4-hydroxy-3-methylphenyl)cyclohexane epoxy resin  curing kinetics  curing process  thermal properties  water absorption  
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