| 层合板的微观破坏机理研究 |
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| 引用本文： | 刘一华
,吴国璋.层合板的微观破坏机理研究[J].合肥工业大学学报(自然科学版),1992(4). |
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| 作者姓名： | 刘一华 吴国璋 |
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| 摘 要： | 本文以代表性体积单元作为基本单元,对同时受载荷作用和湿热变化影响的层合板进行了微观力学分析,给出了单尾板中组分材料的微观应力,从理论上对层合板的微观破坏机理进行了研究。本文提出的微观强度分析方法更能反映层合板的微观破坏机理。
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| 关 键 词： | 组分材料 微观应力 微观破坏机理 裂纹 |
RESEARCH OF MICRODESTRUCTIVE MECHANISM FOR LAMINATES |
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| Liu Yihua Wu Guozhang.RESEARCH OF MICRODESTRUCTIVE MECHANISM FOR LAMINATES[J].Journal of Hefei University of Technology(Natural Science),1992(4). |
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| Authors: | Liu Yihua Wu Guozhang |
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| Institution: | Liu Yihua Wu Guozhang |
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| Abstract: | With the representative volume element as the basis, the micromechanical analysis of laminates was made under loads, moisture and temperature changes at same time and the microstresses of component materials in the monolayer were given. The microdestructive mechanism of the laminates was researched in theory. It can further reflect the microdestructive mechanism of the laminates that the analytic method of the microstrength was put forward in this paper. |
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| Keywords: | Componet materials Microstresses Microdestructive mechanism Cracks |
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