| 碳纤维表面电镀铜的研究 |
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| 引用本文： | 凤仪,应美芳,王成福. 碳纤维表面电镀铜的研究[J]. 合肥工业大学学报(自然科学版), 1993, 0(2) |
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| 作者姓名： | 凤仪 应美芳 王成福 |
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| 基金项目： | 国家自然科学基金资助项目:58971036 |
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| 摘 要： | 本文研究了制造金属基复合材料的关键技术之一——碳纤维表面电镀铜的工艺和设备,性能测试结果表明:碳纤维表面电镀铜层均匀、完整、电镀工艺稳定、设备不损伤碳纤维,可满足工业化生产的需要。
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| 关 键 词： | 金属基复合材料 碳纤维 电镀 |
STUDY ON THE ELECTROPLATING COPPER OF CARBON FIBER |
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| Feng Yi Ying Meifang Wang Chengfu. STUDY ON THE ELECTROPLATING COPPER OF CARBON FIBER[J]. Journal of Hefei University of Technology(Natural Science), 1993, 0(2) |
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| Authors: | Feng Yi Ying Meifang Wang Chengfu |
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| Affiliation: | Feng Yi Ying Meifang Wang Chengfu |
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| Abstract: | A new method of electroplating copper plating on carbon fiber has been investi-gatied. using this method. & complete and satisfactorg copper coating on carbon fiber is achieved. The tensile strength of carbon fiber doesn't degrade greatly after electroplating copper. |
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| Keywords: | composite carbon fiber electroplating |
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