| 适于MEMS器件的低应力Ni-W纳米晶薄膜的制备 |
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| 引用本文： | 汪红,丁桂甫,赵小林,姚锦元,朱军,王志民. 适于MEMS器件的低应力Ni-W纳米晶薄膜的制备[J]. 上海交通大学学报, 2007, 0(Z2) |
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| 作者姓名： | 汪红 丁桂甫 赵小林 姚锦元 朱军 王志民 |
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| 作者单位： | 上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室 上海200030 |
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| 基金项目： | 国家重点实验室基金资助项目(51485030205JW0301)，上海市科学技术委员会科技攻关项目(051111022) |
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| 摘 要： | 以高强度、高耐腐蚀性Ni-W合金为研究对象,探讨了柠檬酸胺-HEDP体系中,各种电沉积工艺参数以及热处理条件对Ni-W合金薄膜应力的影响规律及其在微喷嘴模具上的应用.研究结果表明,在优化的工艺条件下,可获得应力为230 MPa、硬度高达988 HV、无裂纹的纳米晶Ni-W薄膜材料,为其在MEMS微器件、微模具制备上的应用提供了有效途径.
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| 关 键 词： | 内应力 Ni-W纳米晶 微机电系统 电沉积 热处理 |
Fabrication of Low Stress Ni-W Nanocrystalline for MEMS Devices |
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| WANG Hong,DING Gui-fu,ZHAO Xiao-lin,YAO Jin-yuan,ZHU Jun,WANG Zhi-min. Fabrication of Low Stress Ni-W Nanocrystalline for MEMS Devices[J]. Journal of Shanghai Jiaotong University, 2007, 0(Z2) |
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| Authors: | WANG Hong DING Gui-fu ZHAO Xiao-lin YAO Jin-yuan ZHU Jun WANG Zhi-min |
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| Abstract: | Thin film stress is a key factor of functional materials for whether it can be used in MEMS field or not.This paper studied the effect of electrodeposition and heat treatment on the thin film stress of Ni-W alloy in the system of citrate amine-HEDP,and its applications in micro-nozzle.The results show that in the optimum process,the nanocrystalline Ni-W film without crack can be obtained,and its stress is 230 MPa,hardness is 988 HV.In this way,Ni-W film may be widely applied in the manufacture of MEMS device and micro-molding. |
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| Keywords: | internal stress Ni-W nanocrystalline microelectromechanical system(MEMS) electrodeposition heat treatment |
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