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功率半导体器件终端SIPOS/PI复合钝化结构研究
引用本文:郑英兰,王颖,钟玲,吴春瑜.功率半导体器件终端SIPOS/PI复合钝化结构研究[J].辽宁大学学报(自然科学版),2010,37(1):11-14.
作者姓名:郑英兰  王颖  钟玲  吴春瑜
作者单位:1. 沈阳职业技术学院电气工程系,辽宁,沈阳,110045
2. 哈尔滨工程大学信息与通信工程学院,黑龙江,哈尔滨,150001
3. 沈阳炮兵学院雷达教研室,辽宁,沈阳,110162
4. 辽宁大学物理学院,辽宁,沈阳,110036
摘    要:本文采用直流辉光放电法在台面功率半导体器件上生长SIPOS钝化膜.研究结果表明,SIPOS钝化的功率器件性能要好于聚酰亚胺钝化的功率器件,可以有效地提高功率器件的可靠性.基于此提出了SIPOS/PI复合钝化结构来改善台面功率半导体器件的表面特性.

关 键 词:斜角造型器件  半绝缘多晶硅  漏电流  钝化

Study on SIPOS/PI Passivation Structure for Junction Terminal of Power Semiconductor
ZHENG Ying-lan,WANG Ying,ZHONG Ling,WU Chun-yu.Study on SIPOS/PI Passivation Structure for Junction Terminal of Power Semiconductor[J].Journal of Liaoning University(Natural Sciences Edition),2010,37(1):11-14.
Authors:ZHENG Ying-lan  WANG Ying  ZHONG Ling  WU Chun-yu
Institution:1.Department of Electrical Engineering/a>;Shenyang Polytechnic College/a>;Shenyang 110045/a>;Liaoning/a>;China/a>;2.College of Information and Communications Engineering/a>;Harbin Engineering University/a>;Harbin 150001/a>;3.Radar Teaching and Research Section/a>;Shenyang Artillery College/a>;Shen yang 110162/a>;4.Physics College/a>;Liaoning University/a>;Shenyang 110036/a>;China
Abstract:Direct current glow discharge has been employed to prepare the SIPOS passivation films on the beveled power semiconductor devices.Results obtained indicates that the performance of power semiconductor devices passivated by SIPOS are improved,and SIPOS based process is effective and expected to enhance the reliability of device.Based on this,the SIPOS/PI passivation structure is proposed to improve the characteristic of the surface of beveled power semiconductor device.
Keywords:beveled device  SIPOS  Leakage current  passivation  
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