| 微型功率电路板强制对流冷却模拟 |
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| 引用本文： | 隋越.微型功率电路板强制对流冷却模拟[J].渝西学院学报(自然科学版),2012(1):50-52. |
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| 作者姓名： | 隋越 |
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| 作者单位： | 福建闽江学院物理学与电子信息工程系,福建闽江350108 |
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| 基金项目： | 福建省科技厅重点资助项目（2009I0020） |
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| 摘 要： | 针对功率型电路板建立强制对流三维模型,采用有限元方法,模拟电路板强制对流条件下的温度分布图和速度分布图,同时获得电路板表面最高温度和表面最大流速随不同功率密度变化的关系.
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| 关 键 词： | 功率型电路板 强制对流 有限元方法 |
Forced convection cooling simulation of miniature power circuit board |
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| Authors: | SUI Yue |
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| Institution: | SUI Yue (Department of Physics and Electronic Information Engineering,Mingjiang University,Mingjiang Fujian 350108,China) |
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| Abstract: | This paper models the forced convection air cooling of circuit boards populated with multiple integrated circuits（ICs）,which acts as heat sources.This paper also describes the application of finite element method for obtaining the temperature profile and air velocity profile of heated Ics.Finally,this paper discusses the relationship between power density and the maximal temperatures maximum speeds of the ICs surface. |
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| Keywords: | circuit boards air cooling finite element method |
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