复合镀层电触头的冲击磨损与电接触性能研究

本文运用扫描电子显微镜(SEM)对复合镀层触头材料在冲击载荷作用下的表面形貌进行了分析研究,并用俄歇电子能谱仪(AES)对冲击区表面成份进行了分析。结果表明:闭合过程中的机械冲击对该类触头的形貌有严重损坏作用,可引起冲击磨损从而导致电接触性能变化。本文还提出了一种冲击磨损模型,并用它很好地解释了复合镀层触头的冲击磨损机理与电接触性能改变规律,并初步探讨了该类继电器触头的粘接失效机理。研究结果还表明,冲击磨损造成底层镀金层的裸露是导致该类继电器触头粘接的主要因素。这对工程上进一步改善其电接触性能提供了理论依据。

AN INVESTIGATION OF IMPACT WEAR AND CONTACT BEHAVIOR OF MULTI-PLATED ELECTRICAL CONTACT

The scanning electron microscopy (SEM) is used for studing the damage of multi-plated contact under the mechanical impact action. The elemental composi- tions of impacted zones were analyzed by Auger electron speetroscopy (AES). The results show that mechanical impact can cause severe damage of contact and lead to impact wear and contact failures such as contact resistance variation, slow release and even sticking. The model of impact wear is put forward and verified. It is adopted to explain the mechanism of impact wear and contact resistance change caused by impacting. Furthermore, the study predicates that impact wear is one of the main causes leading to contact sticking in this kind of relay.