| 化学镀Ni－P、Ni－Cu－P沉积反应热力学函数的探讨 |
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| 引用本文： | 王国荣,万克宝,宋长生,袁万钟.化学镀Ni－P、Ni－Cu－P沉积反应热力学函数的探讨[J].大连理工大学学报,1995(3). |
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| 作者姓名： | 王国荣 万克宝 宋长生 袁万钟 |
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| 作者单位： | 大连理工大学普通化学教研室 |
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| 摘 要： | 通过测定不同温度下的化学镀Ｎｉ－Ｐ、Ｎｉ－Ｃｕ－Ｐ沉积反应速率，计算出两个沉积反应的表观活化能。尝试把Ｂｏｃｋｒｉｓ方程式应用于化学镀沉积反应的计算中。通过测定沉积量，经适当处理，代入Ｂｏｃｋｒｉｓ方程，计算出两个沉积反应的热力学函数，得到了一些规律性的认识。
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| 关 键 词： | 化学镀 镍基合金 活化能 热力学函数 |
On estimating thermodynamic functions of chemical deposition of Ni-P and Ni-Cu-P |
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| Wang Guorong,Wan Kebao,Song Changsheng,Yuan Wanzhong.On estimating thermodynamic functions of chemical deposition of Ni-P and Ni-Cu-P[J].Journal of Dalian University of Technology,1995(3). |
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| Authors: | Wang Guorong Wan Kebao Song Changsheng Yuan Wanzhong |
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| Abstract: | Based on Bockris equation,a method of estimating thermodynamic functions ofchemical deposition of Ni-P and Ni-Cu-P is introduced.From experimental data,apparentactivation energy is calculated by means of Arrhenius equation. |
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| Keywords: | chemical plating nickel-base alloys activation energy thermdynamical functions |
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