多芯片模块二维互联线分布电感电阻参数提取算法

研究了多芯片模块（ＭＣＭ）中二维互联线的分布电感电阻参数提取算法，在横向电滋波近似下对典型二维互联线（多线带线和多线微带线）的分布参数进行了分析，并在趋肤效应和邻近效应影响较大的数十至数百ＭＨｚ的频率范围内应用边界元方法对互联线中的似稳态磁场进行了求解，得到不同频率下传输线模型的单位长度电感、电阻等参数，其中电感参数为包括互感的矩阵参数，并将互联线导体对邻近导体分布参数的影响进行了计算。

Distributed inductance and resistance parameter extraction of 2D multi chip module interconnection

An algorithm on distributed parameter extraction of a two dimensional multi chip module(MCM) interconnection structure was presented. The distributed parameters of typical two dimension interconnection structures(microstrip line and strip line) in MCM were analyzed based on transverse electromagnetic assumption, and the electromagnetic field in MCM was solved with boundary element method, resistance R(per unit length) of each interconnection and induce matrix L(per unit length) of interconnections were obtained. Because of current skin effect, R and L parameter were extracted from several ten MHz to several hundred MHz, R and L are different along with different frequencies. At last the influence of interconnection line on distributed parameter on adjacent interconnection lines was calculated.