| 耐高温乙烯基酯树脂固化反应动力学研究 |
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| 引用本文： | 黄志雄,秦岩,周祖福. 耐高温乙烯基酯树脂固化反应动力学研究[J]. 华中科技大学学报(自然科学版), 2002, 30(7): 68-70 |
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| 作者姓名： | 黄志雄 秦岩 周祖福 |
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| 作者单位： | 武汉理工大学材料学院 |
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| 基金项目： | 武汉市重点科技攻关项目资助 (9810 0 5 16 3) |
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| 摘 要： | 通过差热分析，计算了耐高温乙烯基酯树脂的固化反应动力学参数，提出了树脂成型过程的动力学模型，并制定了合理的树脂固化工艺制度。用红外分析方法对树脂固化前后的样品进行了测试，验证了合成反应和固化形式，并从结构的角度对树脂性能特征进行了分析。
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| 关 键 词： | 耐高温 乙烯基酯树脂 固化反应动力学 热固性树脂 差热分析 固化工艺 |
| 文章编号： | 1671-4512(2002)07-0068-03 |
| 修稿时间： | 2002-01-15 |
Study on cure reaction kinetics of heat resistant vinyl ester resin |
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| Huang Zhixiong Qin Yan Zhou Zufu Assoc. Prof, College of Material. Sci. , Eng.,Wuhan Univ. of Tech,Wuhan ,China.. Study on cure reaction kinetics of heat resistant vinyl ester resin[J]. JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE, 2002, 30(7): 68-70 |
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| Authors: | Huang Zhixiong Qin Yan Zhou Zufu Assoc. Prof College of Material. Sci. & Eng. Wuhan Univ. of Tech Wuhan China. |
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| Affiliation: | Huang Zhixiong Qin Yan Zhou Zufu Assoc. Prof, College of Material. Sci. & Eng.,Wuhan Univ. of Tech,Wuhan 430070,China. |
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| Abstract: | The kinetics of cure resin was investigated by using differentied scanning calorimetry. The cure reaction of resins was studied. The reasonable curing technology of resin was set up. The basic parameters of curing were also calculated. The molding compound was made on the basis of the matrix. Through the discussion of flow characterization of the molding compound, the reasonable moldition was made. |
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| Keywords: | vinyl resin cure reaction kinetics moldel |
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