添加剂对高铋电解铜体系中铜沉积过程的影响

用稳态法研究了添加剂Ｃｌ－、ｇｌｕｅ、（ＮＨ２）２ＣＳ对高铋电解铜体系阴极铜沉积反应的影响。用ＡＡ、ＳＥＭ、ＸＲＤ等仪器研究了添加剂对阴极铜沉积的组成和晶面取向的影响。结果表明：Ｃｌ－对铜沉积反应起去极化作用。ｇｌｕｅ对铜沉积反应起强极化作用。（ＮＨ２）２ＣＳ能改变铜沉积过程的电化学反应机理，使铜沉积反应出现由扩散控制的极限电流。当Ｃｌ－、ｇｌｕｅ、（ＮＨ２）２ＣＳ共存于电解液中时，既对铜沉积反应起强极化作用，又使铜沉积过程的极限电流降低。以低电流密度（２００Ａ·ｍ－２）电解，添加剂存在时可使阴极铜沉积中铋含量从０．０１３％降至０．００２１％，但添加剂不影响铜沉积的晶面择优取向（２２０）。以高电流密度（１５００Ａ·ｍ－２）电解时，添加剂的存在，会改变铜沉积的晶面择优取向。

THE EFFECT OF ADDITIVES ON THE COPPER DEPOSITION PROCESS IN THE ELECTROLYSIS COPPER SYSTEM OF HIGH BISMUTH

In this paper,we studied the effect of additives Cl -,glue,(NH 2) 2CS on the cathodic copper deposition reaction in the electrolysis copper system of high bismuth by steady state method,and studied the effect of additives on the chemical composition and crystal orientation of the cathodic copper deposition by AA,SEM and XRD.The results obtained indicate that Cl - has an action of unpolarization on copper deposition reaction,glue has an action of the intense polarization on copper deposition reaction.(NH 2) 2CS can change electrochemical reaction mechanism of copper deoposition process,and make copper deposition reaction show limit current.When Cl -,glue and (NH 2) 2CS coexisted in electrolyte,they have an action of the intense polarization on copper deposition reaction and decrease the density of limit current. The results tested indicate that the additives can decrease quantity of bismuth in copper deposition from 0.013% to 0.0021%,but the additives did not effect the predominant crystal orientation (220) of copper deposition when electrolysed at low current density.The additives can change the predominant crystal orientation of copper deposition when electrolysed at high current density.