应用子模型的高密度大规模2.5D转接板内TSV热应力仿真误差分析

本文着重讨论了ANSYS子模型技术对高密度2.5D转接板内TSV (Through Silicon Via)的热应力仿真误差,分析了TSV直径和高度对仿真误差的影响。研究发现子模型仿真误差会随着TSV直径的增加而大幅升高,严重影响子模型热应力计算结果的准确性和可靠性。为解决此问题,本文提出了几种子模型技术的改进仿真方案,并综合比较了各方案的仿真误差以及计算量和计算时间,指出等效简化方法和“嵌入式”子模型结构能在较少的资源消耗下得到更理想的仿真结果。

The Error analysis of sub-modeling method on the thermal-stress simulation of TSV in a high-density large-scale 2.5D interposer

By simulating the thermal-stress of TSV in the high-density large-scale 2.5D interposer, the simulation error caused by ANSYS sub-modeling technique is mainly discussed in this paper. The influences of TSV diameter and TSV height on the simulation error are analyzed, revealing that the simulation error would increase rapidly with a larger TSV. This seriously affects the reliability and accuracy of the stress results of sub-modeling. Meanwhile, several improved methods to sub-modeling structure are proposed and the computing resource and computing time of each method are compared comprehensively. Finally, the equivalent simplification and the "embedded" structure are proved to be more accuracy simulation techniques with less resource consumption.