一种新型芯片封装点胶头夹具结构

点胶头与基板之间的相对位姿是影响芯片封装过程点胶一致性的关键因素之一,该位姿受点胶头夹具重复定位精度与基板表面状况的影响.本文从分析对点胶头装夹的性能要求入手,论述了一套操作简便、能自动定位且重复定位精度高的点胶夹具的结构原理.实验证明,该夹具有效地提高了点胶头的装夹效率,每次更换点胶头只需30 s左右,点胶平均误差从普通夹具的3.27%下降到0.5%.

Structure of a Novel Dispensing Fixture for Chip Packaging

The relative position and orientation（RPO） between the dispensing head and the substrate is one of the key factors affecting the dispensing consistency;the RPO is decided by the repeat positioning accuracy of the dispensing head fixture and the substrate surface condition.By analyzing the dispensing head fixture performance requirements,we discuss the structure of a novel dispensing fixture with characters of easy operation,automatic orientation and with high repeat positioning accuracy.Experiments show that the replacing dispensing head only needs about 30 seconds;the average dispensing error is reduced from 3.27% with regular fixture to 0.5% with the novel fixture.