聚酰胺酸改性环氧树脂耐热性的研究

用4, 4′-二氨基二苯基砜(DDS)做固化剂,采用聚酰胺酸(PAA)对环氧树脂(EP)进行改性,研究了PAA用量、固化剂用量和反应时间对环氧树脂耐热性的影响,采用TG测定不同配比、预反应时间及不同固化温度下改性EP的耐热性,利用SEM对最佳配比固化后样品的表面和断面形貌进行了分析.结果表明,改性树脂最佳固化工艺条件为:120 ℃,1 h→150 ℃,1 h→170 ℃,2 h→200 ℃,2 h→250 ℃,2 h;改性树脂配比为mEP∶mPAA∶mDDS=1∶0.75∶0.08;预反应时间3 h,改性EP的热分解温度为411 ℃,比未改姓EP提高了近80 ℃以上;EP/PAA/DDS固化后样品无明显的两相结构,树脂的相容性较好.

Study on the Epoxy Resin Heat Resistance Modified by Polyamide Acid

The epoxy resin heat resistance was prepared with epoxy modified with PAA, and DDS as curing after the pre-reacting and curing. The effects of the amount of PAA, the amount of curing agent, curing condition, reaction time on the heat resistance of epoxy resin were studied. A better formula and appropriate conditions for curing were chosen. The heat resistance of modified epoxy resin was measured with TG in different proportions, pre-reaction time and different curing conditions. Then, the surface morphology and the fracture morphology of the curing epoxy modified were analyzed with SEM. The result has shown that better curing process conditions of modified epoxy resin are as follows: 120 ℃,1 h→150 ℃,1 h→170 ℃,2 h→200 ℃,2 h→250 ℃,2 h,the proportion is 3h. The decomposition temperature of modified epoxy resin is 411 ℃ after the pre-reacting and curing, which is increased by 80 ℃, compared with the decomposition temperature of non-modified epoxy resin. There is no distinct two-phase structure in EP/PAA/DDS system after the pre-reacting and curing, which indicates that the resin has a good compatibility.