半导体生产线批加工设备调度规则

批加工设备调度是半导体生产线调度的重要组成部分,对半导体生产线性能有重要影响。在综述批加工设备调度研究成果的基础上,提出了同时考虑即将到来工件与下游设备负载情况的半导体生产线批加工设备调度规则(Scheduling Rule for Batch Processing Machines in Semiconductor Wafer Fabrication Facilities,SRB)。基于三种不同规模的半导体生产线模型,在非批加工设备使用不同的调度规则的情况下,对提出的SRB进行了仿真验证。仿真结果表明,与目前常用的固定加工批量调度规则相比,SRB能够更好的改善半导体生产线性能,获得较高的工件移动步数、产量和准时交货率,以及较低的加工周期。

Scheduling Rule for Batch Processing Machines of Semiconductor Wafer Fabrication Facilities

Scheduling for batch processing machines is one of the most important parts of semiconductor wafer fabrication facilities scheduling, which has important impacts on improving performance of semiconductor wafer fabrication facilities. Based on summarization of the state-of-the-art researches on scheduling for batch processing machines of semiconductor wafer fabrication facilities, the scheduling rule for batch processing machines in semiconductor wafer fabrication facilities (SRB), considering future arrival lots and workloads of their successive machines, was proposed. SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines. It can be seen from the simulation results that SRB is prior to the common fixed batch size scheduling rule for batch processing machines on movement, throughput, on-time delivery and cycle time with better performance.