| 不同封装的扩展电阻温度传感器瞬态热响应模型 |
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| 引用本文： | 杨炳良 刘百勇. 不同封装的扩展电阻温度传感器瞬态热响应模型[J]. 华南理工大学学报(自然科学版), 1995, 23(12): 51-58 |
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| 作者姓名： | 杨炳良 刘百勇 |
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| 作者单位： | 华南理工大学应用物理系，香港城市大学电子工程系 |
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| 摘 要： | 研究了扩展电阻温度传感器的封装效应。对扩展电阻传感器封装热阻的测量和瞬态热响应 理论和实验研究。理论结果和实验结果吻合。实验和理论结果表明，管壳的几何形状比封装材料传感器瞬态响应时间的影响更重要。对于要求高灵敏度和快速响应的传感器封装，小型和球型的封装方式总是被推荐。的
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| 关 键 词： | 温度传感器 扩展电阻 封装效应 瞬态热响应 |
MODELING OF TRANSIENT THERMAL RESPONSE OF DIFFERENTLY ENCAPSULATED SPREAD-RESISTANCE TEMPERATURE SENSORS |
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| Yang B L, Liu B Y, Chen D N, Yang C H, Cheng X R, Wong H, Cheng Y C. MODELING OF TRANSIENT THERMAL RESPONSE OF DIFFERENTLY ENCAPSULATED SPREAD-RESISTANCE TEMPERATURE SENSORS[J]. Journal of South China University of Technology(Natural Science Edition), 1995, 23(12): 51-58 |
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| Authors: | Yang B L Liu B Y Chen D N Yang C H Cheng X R Wong H Cheng Y C |
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| Abstract: | In this work, the encapsulation effects of spread-resistance temperature sensors are studied. In addition to the measurement of thermal resistance of the packaging, transient thermal response is investigated both theoretically and experimentally. Good agreement between the theoretical and experimental results is obtained. Results show that the geometry of the case has more profound effect on the sensor response time than that of the packaging material. Small and ball-shaped encapsulation is always recommended for high sensitive and fast-response sensor packaging. For a 2mm diameter ball shape packaging, the response time of the sensor is about 6s. |
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| Keywords: | temperature sensor: spread-resistance4 encapsulated effect transient thermal response |
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