某新型半导体显示产业钢厂房备料区抗震性能分析

以某新型半导体显示产业钢结构厂房备料区为工程背景，建立了厂房钢框架-支撑结构的非线性有限元模型，分别对多遇地震和罕遇地震下的结构抗震性能进行了分析。结果表明，结构整体指标均满足设计规范要求，第3层和第6层的层间位移角较大；罕遇地震下构件损伤主要集中在支撑，而结构底层角柱和中部楼层的边跨梁有轻微损伤；钢支撑能够有效提高结构刚度，减小梁柱的损伤。

Seismic performance analysis of a preparation area with steel structure in the new semiconductor display industry

A nonlinear finite element analysis(FEA) model was proposed to simulate a semiconductor display industrial building equipped with a steel frame brace as a practical engineering case study. The seismic performance of the structure under frequent and rare earthquakes was analyzed. The results show that the overall indexes of the structure meet the requirements of the design codes. However, the inter-story displacement angles of the 3rd and the 6th floors are relatively large. Under rare earthquakes, damage to the members is mainly concentrated in the steel braces. Slight damage occurred in the corner columns at the bottom floor and side beams at middle floors of the structure. The steel braces are shown to effectively improve the structural stiffness and reduce damage to the beams and columns.