基于Taguchi-GA协同的磁性磨料抛光性能预测及制备工艺参数寻优

通过改变黏结法磁性磨料的制备工艺参数来设计正交试验，制备不同系列规格的磁性磨料，并对其进行形貌和成分检测.以3D打印AlSi10Mg板为加工对象，通过平面磁力研磨试验，揭示磁性磨料制备工艺参数对磁力研磨质量的影响规律.基于回归分析，建立参数与响应之间的回归模型，通过遗传算法实现参数优化. 结果表明，在SiC粒径为18~25 μm，Fe与SiC的质量比为4.7，环氧树脂与聚酰胺的质量比为2，固化温度为100 ℃的条件下，材料去除率为1.7 mg/min，表面粗糙度由原始的3.90 μm降低至0.27 μm，降低率为93.1%.

Predicting Polishing Performance of Magnetic Abrasive and Optimizing Its Preparation Process Parameters Based on Taguchi-GA Synergy

In this study， an orthogonal experiment was designed by changing the preparation process parameters of bonded magnetic abrasives. Then， a series of magnetic abrasives with different specifications were prepared， and their morphology and composition were detected. Taking the 3D-printed AlSi10Mg plate as the processing object， the influence of the magnetic abrasive preparation process parameters on the polishing quality was revealed through the planar magnetic abrasive finishing experiment. A regression model between parameters and responses was established based on regression analysis， and the genetic algorithm optimized parameters. The results show that under the condition that SiC is 18~25 μm， the mass ratio of Fe to SiC is 4.7， the mass ratio of resin to curing agent is 2， the curing temperature is 100 °C， the material removal rate is 1.7 mg/min， and the surface roughness is reduced from the original 3.90 μm to 0.27 μm with a reduction of 93.1%.