电解液pH值对电沉积纳米晶Cu的影响

通过直流电沉积纳米晶铜实验,研究电解液pH值对电沉积速率和沉积层微观结构的影响。结果表明,电沉积速率随着电解液pH值的升高而下降。pH值为8.0时,沉积铜层具有明显的(111)方向织构,晶粒尺寸大于100 nm。随着pH值的升高,沉积铜层(200)晶面的择优取向程度不断上升,晶粒尺寸逐渐减小。pH值为9.0时,铜晶粒平均尺寸为44.2 nm。实验发现,电解液pH值的最佳范围为8.8~9.0。

Effects of pH value in electrolytes on electrodeposited nano-crystalline Cu

With the experiment of direct current electro deposition for nano crystalline Cu,the effects of pH value in electrolytes on the deposited rate and micro-mechanism of the deposition were(investigated).Results show that with the increase of pH value,the depositing rate decreases.When pH value is equal to 8.0,the as-deposited Cu has obvious(111) texture and the grain size is(over)(100 nm).As pH value ascends,prior growing facet in(220) direction of the as-deposited Cu increases gradually but the grain size descends.While pH value equals to 9.0,the average size of the(nanocrystalline) Cu is 48 nm.It is also found that the optimal range of the pH value is between 8.8 and 9.0 in the experiment.