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基于热分析的齿轮模态及共振可靠性灵敏度研究
引用本文:王宇宁,孙志礼,杨强,杜永英. 基于热分析的齿轮模态及共振可靠性灵敏度研究[J]. 东北大学学报(自然科学版), 2013, 34(3): 408-412. DOI: -
作者姓名:王宇宁  孙志礼  杨强  杜永英
作者单位:1. 东北大学机械工程与自动化学院,辽宁沈阳,110819
2. 东北大学机械工程与自动化学院,辽宁沈阳110819;沈阳化工大学机械工程学院,辽宁沈阳110142
摘    要:为了研究温度对齿轮结构模态的影响及程度,在齿轮热-结构耦合分析的基础上对齿轮进行了模态分析,将不同工作条件下模态分析结果进行比较,分析温度场对齿轮模态的影响;在考虑温度场这一因素下采用概率设计方法的MonteCarlo模拟法对齿轮进行共振可靠性灵敏度分析.结果表明:由温度变化所引起材料力学性能的变化对各阶固有频率影响的程度不同,由热应力引起的固有频率变化小于由材料力学性能变化引起的固有频率变化;各随机变量中齿轮的模数对共振可靠性的影响最大,分析结果更符合实际工况,为齿轮可靠性设计开辟了新思路.

关 键 词:温度场  热应力  模态  可靠性  灵敏度  

Study on the Gear Mode and Resonance Reliability Sensitivity Based on Thermal Analysis
Wang,Yu-Ning ,Sun,Zhi-Li ,Yang,Qiang ,Du,Yong-Ying. Study on the Gear Mode and Resonance Reliability Sensitivity Based on Thermal Analysis[J]. Journal of Northeastern University(Natural Science), 2013, 34(3): 408-412. DOI: -
Authors:Wang  Yu-Ning   Sun  Zhi-Li   Yang  Qiang   Du  Yong-Ying
Affiliation:(1) School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China; (2) School of Mechanical Engineering, Shenyang University of Chemical Technology, Shenyang 110142, China
Abstract:To study the influence of the temperature on the gear structure mode, modal analysis of gear was done based on the coupled thermal-structural analysis. By comparing the modal analysis results under different working conditions, the influence of temperature field on the gear mode was analyzed. Monte Carlo simulation of the probabilistic design method was performed on the gear resonance reliability sensitivity with considering the factor of temperature field. The results showed that the changes of the material mechanical properties caused by temperature change have different impact on each order natural frequency, whose variation caused by thermal-stress is smaller than that caused by mechanical property change. Among all random variables, gear module has the greatest impact on the resonance reliability. The results agree well with the actual working conditions. The work initiates a new idea in the field of gear reliability design.
Keywords:temperature field   thermal stress   mode   reliability   sensitivity  
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